TWI Industrial Member Report Summary 474/1993
By B C James and D J Kilpatrick
Electrostatic bonding is a process used for joining silicon to glass to make pressure sensors and solar cells. There is little available information about the effect on the process of such factors as surface finish, glass composition, size limitations and bonding parameters or even the suitability of the process for joining metal to glass.
The work described in this report develops bonding parameter windows for joining silicon to Corning 7740, Schott borosilicate glass and Pilkington special melt glass as well as examining the effects of size, surface roughness and bonding environment.