TWI Industrial Member Report Summary 617/1997
T L Dickerson
The report examines die bonding from a mechanical viewpoint. The role of the attachment properties and their effect on stressing is investigated. Analytical models and finite element analysis (FEA) are used to predict the behaviour of typical die-bonded assemblies during thermal loading.
- To examine existing analytical models and to produce finite element models that describe the deformations, strains and stresses that occur as a consequence of bonding dies to substrates.
- To examine and compare the models in the first objective to enable the most appropriate model to be used for different aspects of this work and to make recommendations on their use.
- To give guidance on choosing die attachment media by considering thermo-mechanical design aspects of the die-bonding, qualification testing and in-service.
- To examine the effect of changing the die attachment material or the properties on the likelihood of device failure.
- To investigate claims that some products offer inherently low stress characteristics with the implication that these eliminate device failure or offer lower failure rates.