TWI Industrial Member Report Summary 538/1995
P M Bartholomew
Glob-top resins are increasingly being used to protect semiconductor die, especially where the circuit board footprint and/or height of a packaged component cannot be accommodated. The successful application of a glob-top material depends on its dispensing and curing properties, electrical performance and degree of mechanical and moisture protection afforded to the device.
This report describes the results of literature and industry surveys that were carried out in order to acquire data on available and development glob top materials (together with the results of manufacturers tests), dispensing and curing methods, requirements for materials in order to meet industry needs and materials test methods and standards.
The objectives of the work are as follows:-
- To determine the range of material properties of currently available commercial glob-top resins.
- To determine the main causes of failure in semiconductor devices and relate these to the materials properties required of high performance glob-top encapsulants, including the establishment of the mechanism of moisture ingress tothe surface of the semiconductor chip.
- To establish the range of glob-top resin testing methods used in the semiconductor industry.