Mon, 24 July, 2023
We are pleased to announce that we have been granted a United States patent for a diffusion bonding technique that can be used with compact heat exchangers, heat sinks, cooling loops, process intensification units, and more.
The patent, ‘Diffusion Bonding with a Bonding Surface Coating Material,’ was originally filed in 2019 and was granted on 11 July 2023.
The proprietary technique enables the successful diffusion bonding of aluminium with achievable joint strengths comparable to the heat-treated parent material.
Invented by TWI group manager Alec Gunner and section manager Nick Ludford, the technique produces an autogenous joint without the requirement of interlayers or melting point suppressants.
This patent follows a programme of research to investigate the application of the process to aluminium alloys and other materials, with tests showing that the technique may demonstrate a viable route for the manufacture of compact features and other devices containing complicated internal pathways.
We are delighted to have secured the patent for this innovative new technique, which may offer new technical and commercial opportunities for our Industrial Members.