Frequently Asked Questions
Very few, if any, specifications exist in the open literature for high temperature electronics packaging. Much work is currently being performed to determine the individual materials and processes necessary for survival at elevated temperatures. However, complete high temperature electronics package solutions are elusive and, in most cases, proprietary.
Beyond the evaluations in progress, there is a lack of data for accelerated testing of high temperature electronics. Again, while substantial effort is focused on the materials and devices such as SiC diodes and transistors, the long-term reliability of these materials as components of an overall system has not been characterised.
TWI with its background in materials and electronics packaging is actively pursuing collaboration with industry to develop not only materials for high temperature electronics packages, but also the accelerated test methods and standards that will be necessary to define high temperature electronics packaging specifications.
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