Ceramics can be readily bonded using conventional organic adhesives. However, the temperature capability of these adhesives is severely limiting, for example epoxy and phenolic adhesives can be used up to a temperature of about 150°C. Since ceramics are often used for their high temperature capabilities, ceramic adhesives are most frequently used.
A number of ceramic adhesives have been developed which offer a service temperature of up to 2200°C. These are based on inorganic binders such as alkali silicates and various metal phosphates, with a carbon, alumina, silica, magnesia or zirconia powder filler. These ceramic-based adhesives are available in one- or two-part systems, and have a physical form similar to organic adhesives. The binding agent typically undergoes a reaction with the ceramic powder to give a refractory ceramic that bonds to a ceramic base.
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