Frequently Asked Questions
Dense ceramic parts can be joined together into a monolithic piece with few signs of the initial interface using a combination of pressure and temperature.
The process is relatively simple when joining identical materials, but complications arise when the materials are dissimilar. Direct diffusion bonding of ceramic to ceramic would be slow; however, the process can be facilitated by interposing a metallic or glassy interlayer between the two substrates. This technique can similarly be used when joining ceramics to metals.
As well as formation of the joint interface, bonding may also occur because of chemical reactions between the components. This situation may be critical, since brittle, intermetallic constituents may form which would have an adverse effect upon the bond strength.
- minimum distortion and deformation;
- accurate dimension control in the final component;
- thin and thick sections can be joined to each other;
- machining costs may be significantly reduced;
- mixed coefficient of thermal expansion joints are possible;
- simultaneous manufacture of many bonds in a complex joint configuration;
- no low-temperature capability filler metals required and hence upper service temperature is high.
- significant amounts of strain may be generated at the interface leading to lower performance, or premature failure, of the bond;
- capital equipment costs are high;
- high temperature and long times at temperature;