Below is a range of commonly used acronyms in the electronics industry, and what they stand for:
| ACA |
Anisotropic Conductive Adhesive |
| ACF |
Anisotropic Conductive Film |
| AOI |
Automated Optical Inspection |
| ASIC |
Application Specific Integrated Circuit |
| ATE |
Automated Test Equipment |
| BGA |
Ball Grid Array |
| CAD |
Computer Aided Design |
| CCD |
Charge Coupled Device |
| CEM |
Contract Electronics Manufacturer |
| CMOS |
Complementary Metal Oxide Semiconductor |
| COB |
Chip On Board |
| COF |
Chip On Flex |
| COG |
Chip On Glass |
| CSP |
Chip Scale Package |
| CTE |
Coefficient of Thermal Expansion |
| DCA |
Direct Chip Attach |
| DIP |
Dual In-line Package |
| EMC |
Electromagnetic Compatibility |
| EMI |
Electromagnetic Interference |
| ENIG |
Electroless Nickel/Immersion Gold |
| EPROM |
Electrically Programmable Read Only Memory |
| ESD |
Electrostatic Discharge |
| FPT |
Fine Pitch Technology |
| HASL |
Hot Air Solder Levelled |
| HDI |
High Density Interconnect |
| ICT |
In Circuit Test |
| IPC |
Institute of Interconnecting and Packaging Electronic Circuits |
| IPD |
Integrated Passive Device |
| ISO |
International Organisation of Standards |
| MCM |
Multi Chip Module |
| MELF |
Metal Electrode Leadless Face |
| OSP |
Organic Solderability Protective |
| PLCC |
Plastic Leaded Chip Carrier |
| PTH |
Plated Through Hole |
| QFP |
Quad Flat Pack |
| SIP |
System In a Package |
| SIR |
Surface Insulation Resistance |
| SMT |
Surface Mount Technology |
| SOC |
System On a Chip |
| SOIC |
Small Outline Integrated Circuit |
| SOP |
Small Outline Package |
| SOT |
Small Outline Transistor |
| SPC |
Statistical Process Control |
| TSOP |
Thin Small Outline Package |