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Can you define some of the acronyms used for electronic components and assembly?


Frequently Asked Questions

Below is a range of commonly used acronyms in the electronics industry, and what they stand for:

ACA Anisotropic Conductive Adhesive
ACF Anisotropic Conductive Film
AOI Automated Optical Inspection
ASIC Application Specific Integrated Circuit
ATE Automated Test Equipment
BGA Ball Grid Array
CAD Computer Aided Design
CCD Charge Coupled Device
CEM Contract Electronics Manufacturer
CMOS Complementary Metal Oxide Semiconductor
COB Chip On Board
COF Chip On Flex
COG Chip On Glass
CSP Chip Scale Package
CTE Coefficient of Thermal Expansion
DCA Direct Chip Attach
DIP Dual In-line Package
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
ENIG Electroless Nickel/Immersion Gold
EPROM Electrically Programmable Read Only Memory
ESD Electrostatic Discharge
FPT Fine Pitch Technology
HASL Hot Air Solder Levelled
HDI High Density Interconnect
ICT In Circuit Test
IPC Institute of Interconnecting and Packaging Electronic Circuits
IPD Integrated Passive Device
ISO International Organisation of Standards
MCM Multi Chip Module
MELF Metal Electrode Leadless Face
OSP Organic Solderability Protective
PLCC Plastic Leaded Chip Carrier
PTH Plated Through Hole
QFP Quad Flat Pack
SIP System In a Package
SIR Surface Insulation Resistance
SMT Surface Mount Technology
SOC System On a Chip
SOIC Small Outline Integrated Circuit
SOP Small Outline Package
SOT Small Outline Transistor
SPC Statistical Process Control
TSOP Thin Small Outline Package

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