This is dependent on the particular adhesive in question. Thermoplastic ECAs can be readily reworked using elevated temperatures to melt the resin (although care must be taken to prevent damage to the reworked component). Thermoset adhesives are far more difficult to rework, as they cross-link during cure and therefore do not melt on re-heating. Heat and/or aggressive chemicals can be used to soften the resin, plus force to remove the component. However, such techniques are potentially damaging to boards and devices.