3D Packaging has become a key enabling technology in mainstream electronic products. This Network event provides an opportunity to learn from industry experts about the latest developments in this exciting technology from Chip through Package to end application. In addition to speakers from IeMRC, Plessey Semiconductor, Mentor Graphics, ST Microelectronics and Lancaster University, delegates have the oppotunity to meet with industry suppliers such as ANSYS, Inseto and Optocap at the co-located exhibit.
The agenda for this event is available on our website
Event hosted by: TWI
Event supported by: IeMRC and IMAPS UK
If you are interested in sponsoring or exhibiting please email
or call Paul Jarvie +44(0) 7739427766.