A new project to raise technical awareness of the benefits of chip on board (COB) assembly, compared with conventional surface mount technology (SMT), is studying the cost savings and increased packaging density offered by flip-chip on board (F-COB) techniques.
This group sponsored project, run by the Microtechnology Centre at TWI, is still open to industrial sponsorship.
Most companies producing COB products use the latest die and wire bonding interconnection processes but the greatest advantages are still to be gained.
Flip-chip fabrication can reduce unit size and weight, allow short signal paths and greater interconnect density. The new assembly technology presents manufacturers with at least an 80% increase in useful board space and can reduce component height also by a minimum 80%.
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