Many companies starting to explore lead-free solders experience problems when trying to control the wetting of components and substrates.
Failure to achieve a high quality, controllable process leads to wastage, re-working and poor product reliability.
Increasing numbers of companies are approaching TWI, seeking to avoid these problems. TWI has responded by investing in equipment to provide a better understanding of the factors relevant in the lead-free soldering process. It is also a useful tool to evaluate the effectiveness of the new lead-free flux chemistries for removing oxide and surface contamination from component terminations and PCB finishes.
This is achieved by measuring the wetting force of the solder on a particular substrate and the time for wetting to occur. A component or substrate is immersed into molten solder. The equipment then measures the force exerted on the component as the solder wets the surface.
Components ranging from though-hole to 0402 surface mount parts can be accommodated in these tests.
The testing procedure delivers a graph of wetting force versus time for a set of components. Profiling such as this leads to a reduction in process variation and increased confidence in the use of lead free solders.
For more information, please contact us.