Connect, no. 135, March/April 2005, p.3
The reliability of printed circuit boards which use lead-free solder can now be modelled using calcePWA software at TWI.
The software simulates the effect of temperature profiles and mechanical loading over the design life of a PCB, to predict times to failure. This approach indicates where joints will fail as a function of thermal and mechanical loadings.
Costly field failures can be avoided by modifying PCBs at the design stage. TWI can simulate boards made with leaded or unleaded solders, for a range of industry sectors including military, automotive, avionics/space and consumer electronics.
For more information, please contact us.