Flip chip die presently accounts for around 2% of the 60 billion integrated circuit devices produced each year but it is predicated to grow to 10% by 2005. This expansion will occur because of the relentless increase in chip input/output (I/O) count, ever higher operating frequencies, pressure to achieve a very small form factor and the need to achieve the lowest possible first level packaging costs. To service this industry to best effect, the Microtechnology Group within TWI has developed extensive flip chip assembly and reliability testing capabilities.
Member companies requiring prototype work, new product introduction set-up, process evaluation or technology demonstration work can make use of the comprehensive expertise and equipment for all aspects of production - design, materials selection, parameter optimisation and reliability testing.
Within TWI's class 10000 clean room facility at Granta Park site are an automatic ball bonder, a high accuracy Finetech Fineplacer flip chip placement and bonding machine and an eight-position, bi-directional turret head Palomar3500II automated assembly machine. These allow bumping and placement to sub 100µm pitches.
Joint integrity assessment is another service of major importance to the industry. The Microtechnology Department offers a wide range of reliability testing including HAST testing, humidity tolerance; corrosion monitoring; thermal storage cycling. Continuous electrical continuity monitoring, material and joint strength evaluation and failure mode analysis are also provided, making the TWI package of services the most comprehensive available.