It was announced recently that a Faraday Partnership in Electronics and Photonics Packaging and Interconnection (EPPIC) has been awarded by the DTI and EPSRC to a group of organisations led by TWI. The project will be directed by Norman Stockham at TWI.
The project brings together two leading UK Research and Technology Organisations in packaging and assembly (TWI and ITRI) with five leading universities (Sheffield, Durham, Leeds, Heriot-Watt and Cambridge) and more than 20 industrial companies actively driving the partnership forward. EPPIC will co-ordinate, for the first time, the UK industry's research effort on packaging, interconnect and manufacture for the electronics and photonics sectors. It will direct programmes into the priority areas of high speed/power, harsh environment, integrated optical/electronic, high density, high reliability, and low cost packaging. Both sectors move very rapidly and require strong UK IP and a skilled workforce.
The formation of the EPPIC Faraday Partnership is in recognition of the fundamental importance of packaging technology in the electronics and photonics sectors and its impact on product and company viability.
Industrial and academic support will be provided through:
- development of strong and effective links between academia and industry
- a core research programme underpinning product and process development
- development of improved education and training programmes to provide an increase in the UK skill base
- direct industrial support through expert help desks, people exchanges, product, process and design reviews, IP support and seminars
- a nationally recognised network with comprehensive knowledge based database.
If you would like further information, please contact us.
EPPIC Faraday Partnership website.