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Improved facility for high temperature diffusion bonding

Connect, May/June 1998

Diffusion bonding unit with radiant heating
Diffusion bonding unit with radiant heating

The Ceramics Group at TWI has converted one of its induction heated diffusion bonding units to radiant heating. This allows the heat treatment of samples 200mm diameter and 250mm high to temperatures in excess of 1850◦C. A simultaneous bonding pressure of 7000kg can be applied and the equipment (which is heated using carbon/carbon composite elements) can operate in vacuum or inert atmosphere.

This facility is now uniquely placed to undertake large-scale diffusion bonding and hot pressing of metals, glasses and ceramics.

To find out more, please contact Wendy Hanson, Manager, Ceramics Group. E-mail:

For more information please email: